{"id":14738,"date":"2025-02-22T07:00:20","date_gmt":"2025-02-22T07:00:20","guid":{"rendered":"https:\/\/www.ruydelacerda.pt\/capabilities-and-solutions-for-implementing-in-mold-electronics-technology-for-smart-products\/"},"modified":"2025-11-26T16:22:12","modified_gmt":"2025-11-26T16:22:12","slug":"capabilities-and-solutions-for-implementing-in-mold-electronics-technology-for-smart-products","status":"publish","type":"post","link":"https:\/\/www.ruydelacerda.pt\/en\/capabilities-and-solutions-for-implementing-in-mold-electronics-technology-for-smart-products\/","title":{"rendered":"Capabilities and Solutions for Implementing In-Mold Electronics Technology for Smart Products"},"content":{"rendered":"\t\t
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Por Catarina Faria, S\u00edlvia Cruz , Do PIEP, para a revista \u201c O Molde \u201c<\/strong><\/p>\n

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(English Below) \ud83c\uddf5\ud83c\uddf9<\/p>\n

A tecnologia In-Mold Electronics (IME)<\/em>, integra circuitos eletr\u00f3nicos diretamente em substratos polim\u00e9ricos durante o processo de molda\u00e7\u00e3o por inje\u00e7\u00e3o. Esta tecnologia representa uma revolu\u00e7\u00e3o na produ\u00e7\u00e3o de dispositivos multifuncionais, a redu\u00e7\u00e3o de componentes e, consequentemente, peso, resultando em dispositivos mais leves e compactos, ao mesmo tempo em que proporciona maior flexibilidade e versatilidade dos dispositivos, permitindo a integra\u00e7\u00e3o de funcionalidades eletr\u00f3nicas. Estas caracter\u00edsticas tornam a IME<\/em> uma solu\u00e7\u00e3o promissora para diversos setores, como a ind\u00fastria autom\u00f3vel, m\u00e9dica ou de embalagens.<\/p>\n

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Apesar do seu elevado potencial tecnol\u00f3gico, a tecnologia IME<\/em> apresenta ainda alguns desafios, principalmente no que toca \u00e0 compatibilidade dos materiais, a precis\u00e3o dos processos de impress\u00e3o, a estabilidade t\u00e9rmica e mec\u00e2nica dos materiais durante o processo de molda\u00e7\u00e3o.<\/p>\n

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Capacidades t\u00e9cnicas do PIEP e da Ruy de Lacerda<\/strong><\/p>\n

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Nesse contexto, o PIEP- P\u00f3lo de Inova\u00e7\u00e3o em Engenharia de Pol\u00edmeros, reconhecido pela sua atua\u00e7\u00e3o na inova\u00e7\u00e3o e desenvolvimento de novas solu\u00e7\u00f5es tecnol\u00f3gicas, tem concentrado esfor\u00e7os em otimizar a implementa\u00e7\u00e3o da produ\u00e7\u00e3o de solu\u00e7\u00f5es por IME e superar os desafios produtivos. A transi\u00e7\u00e3o do processo IME<\/em> de uma produ\u00e7\u00e3o em pequena escala para larga escala envolve diversos desafios que afetam diretamente a qualidade dos produtos finais e a viabilidade da tecnologia. Por este motivo, o PIEP tem trabalhado em colabora\u00e7\u00e3o com a empresa Ruy de Lacerda, especializada em fornecer equipamentos, ferramentas e materiais para impress\u00e3o industrial, com o objetivo de otimizar o scale-up<\/em> da produ\u00e7\u00e3o de solu\u00e7\u00f5es por IME e superar os desafios produtivos.<\/p>\n

Principal tecnologia de impress\u00e3o para IME<\/strong><\/p>\n

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A impress\u00e3o por serigrafia tem-se destacado como tecnologia predominante devido \u00e0 alta resolu\u00e7\u00e3o e compatibilidade com as tintas condutoras. No entanto, a escalabilidade do processo de impress\u00e3o por serigrafia exige a supera\u00e7\u00e3o de desafios relacionados \u00e0 repetibilidade. Para viabilizar o scale-up<\/em> de solu\u00e7\u00f5es IME<\/em>, \u00e9 essencial que as telas de impress\u00e3o e as tintas condutoras sejam adequadas para garantir a uniformidade na espessura do circuito, sem defeitos de alinhamento ou varia\u00e7\u00f5es que possam comprometer a performance do dispositivo eletr\u00f3nico. A qualidade de impress\u00e3o deve, por isso, ser rigorosamente controlada para evitar a quebra dos circuitos condutores e, consequentemente, comprometer a condutividade el\u00e9trica dos circuitos.<\/p>\n

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Adicionalmente, a termoforma\u00e7\u00e3o dos circuitos \u00e9 outro aspeto importante porque confere maior flexibilidade pois permite a sua adapta\u00e7\u00e3o dos circuitos a diferentes substratos e geometria dos moldes. Esta t\u00e9cnica permite que os circuitos impressos sejam moldados em formas mais complexas e ajustadas aos requisitos de flexibilidade dos dispositivos finais. Ao ser aplicada ap\u00f3s a impress\u00e3o dos circuitos, esta tecnologia ajuda a garantir que os circuitos mantenham sua integridade, mesmo quando submetidos a deforma\u00e7\u00f5es ou altera\u00e7\u00f5es dimensionais.<\/p>\n

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Durante o processo de molda\u00e7\u00e3o por inje\u00e7\u00e3o, os materiais (tinta condutoras, tintas decorativas e substrato) s\u00e3o sujeitos a condi\u00e7\u00f5es extremas como, por exemplo, a elevadas taxas de corte e temperaturas, etc., que podem comprometer a qualidade da integra\u00e7\u00e3o dos circuitos. Os par\u00e2metros do processo de molda\u00e7\u00e3o por inje\u00e7\u00e3o devem, dessa forma, ser ajustados para garantir que os circuitos n\u00e3o sejam danificados assegurando as suas propriedades el\u00e9tricas. A capacidade de otimizar os par\u00e2metros do processo, incluindo a press\u00e3o, temperaturas do molde e do fundido, entre outros, \u00e9 fundamental para garantir a consist\u00eancia dos circuitos bem como a repetibilidade do processo.<\/p>\n

Para al\u00e9m disso, como principais desafios \u00e9 de destacar a compatibilidade entre materiais utilizados. Durante o processo de molda\u00e7\u00e3o, as diferen\u00e7as de coeficiente de expans\u00e3o t\u00e9rmica entre os materiais podem causar deslocamento do substrato polim\u00e9rico ou wash-out<\/em> da tinta condutora, comprometendo a funcionalidade dos dispositivos. Para mitigar estes riscos, \u00e9 essencial selecionar tintas condutoras e substratos com propriedades de ader\u00eancia otimizadas. As propriedades el\u00e9tricas e mec\u00e2nicas das tintas devem tamb\u00e9m ser est\u00e1veis sob uma ampla gama de condi\u00e7\u00f5es ambientais, como temperaturas extremas ou exposi\u00e7\u00e3o \u00e0 humidade.<\/p>\n

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A Import\u00e2ncia de Parcerias no Desenvolvimento de Novas Solu\u00e7\u00f5es<\/strong><\/p>\n

O trabalho do PIEP tem, por isso, incidido na capacita\u00e7\u00e3o tecnol\u00f3gica e de recursos para o desenvolvimento de solu\u00e7\u00f5es funcionais que permitam a transi\u00e7\u00e3o do IME para a produ\u00e7\u00e3o em larga escala. Por meio de apoio t\u00e9cnico \u00e0s empresas do setor, o PIEP contribui para a supera\u00e7\u00e3o dos desafios tecnol\u00f3gicos e para o fortalecimento da competitividade industrial.\u00a0 Nesse \u00e2mbito, no passado dia 24 de setembro 2024 realizou-se nas instala\u00e7\u00f5es do PIEP, um workshop dedicado \u00e0 divulga\u00e7\u00e3o da import\u00e2ncia da eletr\u00f3nica impressa na ind\u00fastria dos pl\u00e1sticos. Este workshop contou com a presen\u00e7a de especialistas no ramo da Eletr\u00f3nica Impressa como a Universidade do Minho, e entidades nacionais como a GLN Advanced Solutions<\/em> que j\u00e1 utilizam a tecnologia IME <\/em>nos seus produtos. Com a dinamiza\u00e7\u00e3o deste workshop, o PIEP divulgou a sua capacidade instalada, mas tamb\u00e9m, proporcionou um espa\u00e7o de troca de conhecimento sobre tend\u00eancias de mercado e refor\u00e7ou o compromisso do PIEP em fomentar a inova\u00e7\u00e3o no setor de eletr\u00f3nica impressa.<\/p>\n

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Esta iniciativa decorrente no \u00e2mbito do Polarise: Innovation in Polymer Engineering for a Circular and Digital Environment <\/em>permitiu delinear a sinergia entre a experi\u00eancia do PIEP no que toca ao processo de molda\u00e7\u00e3o com a experi\u00eancia e perspetivas trazidas pelos v\u00e1rios participantes. Este esfor\u00e7o colaborativo permite o desenvolvimento de solu\u00e7\u00f5es inovadoras, capazes de superar os desafios t\u00e9cnicos pelos quais a ind\u00fastria necessita ultrapassar, e viabilizar a implementa\u00e7\u00e3o desta tecnologia \u00e0 escala industrial.<\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t

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\ud83c\uddec\ud83c\udde7<\/h3>\n

Capacities and Solutions for Implementing In-Mold Electronics Technology for Smart Products<\/strong><\/p>\n

By Catarina Faria and S\u00edlvia Cruz, from PIEP, for the magazine “O Molde”<\/strong><\/p>\n

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I<\/strong>n-Mold Electronics (IME) technology integrates electronic circuits directly into polymer substrates during the injection molding process. This represents a breakthrough in the production of multifunctional devices by reducing components and weight, resulting in lighter and more compact devices while offering greater flexibility and versatility, enabling the seamless integration of electronic functionalities. These features make IME a promising solution for various sectors, including the automotive, medical, and packaging industries.<\/p>\n

Despite its high technological potential, IME technology still faces challenges, particularly regarding material compatibility, printing process precision, and thermal and mechanical stability during molding.<\/p>\n

Technical Capabilities of PIEP and Ruy de Lacerda<\/strong><\/p>\n

In this context, PIEP – Innovation Hub in Polymer Engineering, known for its expertise in technological innovation and development, has focused on optimizing the IME production process and overcoming industrial challenges. The transition from small-scale to large-scale IME production involves various obstacles that directly affect product quality and the feasibility of the technology.<\/p>\n

For this reason, PIEP has collaborated with Ruy de Lacerda, a company specialized in providing equipment, tools, and materials for industrial printing, to optimize the scale-up of IME solutions and address production challenges.<\/p>\n

Main Printing Technology for IME<\/strong><\/p>\n

Screen printing has emerged as the dominant technology due to its high resolution and compatibility with conductive inks. However, scaling up this process requires overcoming challenges related to repeatability. To enable IME solutions at an industrial scale, printing screens and conductive inks must ensure uniform circuit thickness without alignment defects or variations that could impact electronic performance.<\/p>\n

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Additionally, thermoforming plays a crucial role in enhancing circuit flexibility, allowing adaptation to different substrates and mold geometries. This technique enables printed circuits to be shaped into more complex forms, ensuring they maintain their integrity even under deformation or dimensional changes.<\/p>\n

During the injection molding process, materials (conductive inks, decorative inks, and substrates) are subjected to extreme conditions, such as high shear rates and temperatures, which can compromise circuit integration. Process parameters must be carefully adjusted to prevent damage and maintain electrical properties. Controlling pressure, mold, and melt temperatures is essential for consistent circuit quality and process repeatability.<\/p>\n

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Furthermore, material compatibility remains a critical challenge. Differences in thermal expansion coefficients can lead to substrate displacement or conductive ink wash-out, affecting device functionality. Selecting conductive inks and substrates with optimized adhesion properties is key to mitigating these risks. Conductive inks must also maintain stable electrical and mechanical properties across a wide range of environmental conditions, including temperature extremes and humidity exposure.<\/p>\n

The Importance of Partnerships in Developing New Solutions<\/strong><\/p>\n

PIEP has focused on technological capability building and developing functional solutions to transition IME to large-scale production. By providing technical support to industry players, PIEP contributes to overcoming technological challenges and strengthening industrial competitiveness.<\/p>\n

In this regard, on September 24, 2024, a workshop was held at PIEP’s facilities to highlight the importance of printed electronics in the plastics industry. The event featured experts from the Printed Electronics sector, including the University of Minho and national entities such as GLN Advanced Solutions, which already apply IME technology in their products.<\/p>\n

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By organizing this workshop, PIEP not only showcased its installed capabilities but also facilitated knowledge exchange on market trends and reinforced its commitment to driving innovation in the printed electronics sector.<\/p>\n

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This initiative, developed under Polarise: Innovation in Polymer Engineering for a Circular and Digital Environment, strengthened synergies between PIEP\u2019s expertise in molding processes and the perspectives shared by industry participants. This collaborative effort is essential for developing innovative solutions, overcoming technical challenges, and enabling the industrial-scale implementation of IME technology.<\/p>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t

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In-Mold Electronics (IME) technology integrates electronic circuits directly into polymer substrates during the injection-moulding process. This technology represents a revolution in the production of multifunctional devices, reducing components and, consequently, weight, resulting in lighter and more compact devices\u2026<\/p>\n","protected":false},"author":2,"featured_media":13771,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"_joinchat":[],"footnotes":""},"categories":[181],"tags":[],"class_list":["post-14738","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-rdl-institutional"],"acf":[],"_links":{"self":[{"href":"https:\/\/www.ruydelacerda.pt\/en\/wp-json\/wp\/v2\/posts\/14738","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.ruydelacerda.pt\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.ruydelacerda.pt\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.ruydelacerda.pt\/en\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/www.ruydelacerda.pt\/en\/wp-json\/wp\/v2\/comments?post=14738"}],"version-history":[{"count":1,"href":"https:\/\/www.ruydelacerda.pt\/en\/wp-json\/wp\/v2\/posts\/14738\/revisions"}],"predecessor-version":[{"id":14739,"href":"https:\/\/www.ruydelacerda.pt\/en\/wp-json\/wp\/v2\/posts\/14738\/revisions\/14739"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.ruydelacerda.pt\/en\/wp-json\/wp\/v2\/media\/13771"}],"wp:attachment":[{"href":"https:\/\/www.ruydelacerda.pt\/en\/wp-json\/wp\/v2\/media?parent=14738"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.ruydelacerda.pt\/en\/wp-json\/wp\/v2\/categories?post=14738"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.ruydelacerda.pt\/en\/wp-json\/wp\/v2\/tags?post=14738"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}